FermiTron Logo
The NPI Pipeline

The End-to-End NPI Workflow

Our proven 4-phase system for bringing hardware to life. Engage our studio for the full product lifecycle, or drop securely into any phase of the workflow to execute your pilot production runs.

01
ARCHITECTURE

Engineering & Design

  • Hardware Design

    [ ALTIUM DESIGNER ]

    Full-lifecycle schematic capture and high-density PCB layout optimized for signal integrity.

  • ECAD/MCAD 3D Integration

    [ STEP / IGES EXPORT ]

    Exporting precise 3D models to collaborate seamlessly with mechanical engineering teams, verifying connector alignments and spatial clearances before fabrication.

  • DFM & DFT Engineering

    [ PROACTIVE REVIEW ]

    Proactive Design for Manufacturing and Testability reviews, ensuring your layout is optimized for high-yield, cost-effective production before a single bare board is fabricated.

  • Fabrication Output

    [ GERBER / ODB++ ]

    Generating flawless manufacturing data packages to guarantee error-free bare-board fabrication.

  • Firmware Engineering

    [ STM32 / NORDIC MCU ]

    Developing optimized bare-metal & RTOS code simultaneously with hardware fabrication to eliminate timeline bottlenecks.

02
PROCUREMENT

Supply Chain & Prep

  • Secure BOM Sourcing

    [ FRANCHISED ONLY ]

    Sourcing components exclusively from original manufacturers and authorized franchised distributors, guaranteeing 100% component authenticity and eliminating counterfeit risks.

  • Bare-Board Verification

    [ IPC-A-600 STANDARD ]

    Incoming QA inspection of fabricated PCBs against acceptability standards to ensure exact alignment with design specifications before physical assembly begins.

03
MANUFACTURING

Precision Assembly

  • Solder Paste Deposition

    [ SEMI-AUTO STENCIL ]

    Utilizing high-precision stencil printing to guarantee a Zero-Bridge standard before component placement begins.

  • Robotic Placement

    [ NEODEN SMT SYSTEMS ]

    Automated Pick-and-Place systems executing high-density SMD and BGA population with surgical accuracy.

  • Thermal Reflow

    [ 6-ZONE PROFILING ]

    Intelligent thermal profiling to permanently bond components while protecting delicate silicon packaging.

  • Thru-Hole & Micro-Rework

    [ JBC PRECISION STATIONS ]

    Elite thermal control for delicate manual soldering and advanced micro-component recovery, saving expensive boards from the scrap heap.

04
QUALITY ASSURANCE

Validation & Deployment

  • PCBA QA & Inspection

    [ IPC-A-610 STANDARD ]

    Digital microscopy for high-resolution visual validation of critical joints, ensuring all fully assembled boards meet stringent acceptability benchmarks.

  • Systems Integration

    [ FIRMWARE FLASHING ]

    Securely flashing the parallel-developed firmware directly onto the assembled hardware.

  • Lab Validation

    [ BENCH DIAGNOSTICS ]

    Utilizing Oscilloscopes, Digital Multimeters, and Spectrum Analysis to verify power rail stability and RF signal integrity.

  • Final FCT

    [ 100% FUNCTIONAL TESTING ]

    Every single assembly undergoes active testing to guarantee "power-on readiness" before it is cleared for shipping. No dead-on-arrival boards.

  • Serialization & Traceability

    [ BOARD-LEVEL TRACKING ]

    Custom barcoding and board-level serialization for strict inventory management, MAC address tracking, and seamless scaling into mass production.